晶圆扩膜机 （Wafer Expander）性能及特点为：
很均匀的扩张已切割或破裂的晶圆，使它能达到所需晶粒的距离，然后改善切割后的制程及晶粒的处理
Uniformly expands diced and 1 or fractured wafers to produce the required die interval .Signilicantly improves post-dicing chip/die handing.
特点：
1. 有不同种的扩张比率.
2. 可调整的扩张速度.
3. 配备温度扩张台.
4. 扩张胶膜及晶圆可自动被固定的.
5. 扩张夹具为树脂锈花圈或环状夹紧物,由内圈和外圈组成,可自动夹紧被扩张的晶圆和胶膜.
6. 简单的机械装置,免维修的设计.
Features：
1. Expansion ratio can be freely varied.
2. Expansion speed is also variable.
3. Equipped with a heated expansion stage
4. Expanded film / wafer can be griped automatically.
Features：
1. Expansion ratio can be freely varied.
2. Expansion speed is also variable.
3. Equipped with a heated expansion stage
4. Expanded film / wafer can be griped automatically.
5. Resin double rings / grip rings the expansion jig consisting of inner and outer ones for automatic grips of expanded wafer / film.
6. Simple mechanism maintenance-free design.
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