该设备为全自动设备，主要用于半导体分立器件器件GPP的电参数分析、测试。该设备配接测试仪后，能自动完成芯片的电参数测试功能。
The equipment is fully automatic，which is mainly used for the analysis and test of the electrical parameters of the discrete device and GPP chip.After it is connected with the tester,it can automatically test the electrical parameter ａnd function of the chip.
主要技术指标 Main Specifications
| 可测片径 | 3″、4″、5″ | Wafer Size | 3″、4″、5″ |
| 行程 | 170mm×240mm | Max. Travel Range | 170mm×240mm |
| 定位精度 | ≤±0.030mm/150mm | X/Y Positioning Accuracy | ≤±0.030mm/150mm |
| 步进分辨率 | 0.001mm | X/Y Resolution | 0.001mm |
| Z向行程 | 10mm | Chuck Z-axis Travel | 10mm |
| Z向重复定位精度 | ≤±0.003mm | Z-axis Positioning Accuracy | ≤±0.003mm |
| Z向分辨率 | 0.001mm | Z-axis Resolution | 0.001mm |
| θ向自动调节范围 | ±10° | θ Rotation Angle | ±10° |
| θ向分辨率 | 0.0013° | θ Resolution | 0.0013° |
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