蓝宝石晶体抛光用GC 400#绿碳化硅研磨粉
绿碳化硅研磨粉用于光学晶体、光学玻璃、人造板岩、合金材料的研磨去除。在半导体行业,GC 400#绿碳化硅研磨粉可以用来研磨蓝宝石晶体,部分代替碳化硼,降低研磨成本。

- PRODUCT/产品: Green Silicon Carbide JIS400#/绿碳化硅400#
- Physical Index/物理参数:
Hardness: HV/维氏硬度 | 3280-3400kg/mm2 |
Hardness: Mohs/莫氏硬度 | 9.4-9.5 |
Specific Gravity/比重 | 3.2 g/cm3 |
Particle Shape/颗粒形态 | Fine powder/细小粉末 |
Color/颜色 | Green/绿色 |
Bulk density(LPD)/堆积密度 | 1.15-1.25 g/cm3 |
Crystal shape/晶型 | Hexagonal/六方晶型 |
Melting Point/熔点 | dissociated at about 2600°C/2600°C游离 |
Maximum service temperature/使用温度上限 | 1900°C |
Thermal conductivity/导热系数 | 0.013 cal/cm2.sec (900°C) |
Thermal expansion coefficient/热膨胀系数 | 7-9 x10-6 /°C (0-1600°C) |
- Chemical Composition/化学成分:
Chemical Item/化学成分 | Guarantee Value/保证值(%) | Typical Value/典型值(%) |
SiC/碳化硅 | ≥99% | 99.05 |
Free Si/游离硅 | ≤0.2 | 0.10 |
Free C/游离碳 | ≤0.1 | 0.05 |
Fe2O3/三氧化二铁 | ≤0.1 | 0.04 |
SiO2/二氧化硅 | ≤0.2 | 0.20 |
- Particle size distribution/粒度分布 (By Laser Analyzer LS609/激光粒度分析仪LS609) :
Size/粒径 | Guarantee Value/保证值 | Typical Value/典型值 |
D10(um) | ≥23 | 23.633 |
D50(um) | 36-42 | 37.407 |
D90(um) | ≤69 | 59.941 |
- Applications/用途:
- Grinding and polishing optical glass, piezoelectric ceramics, quartz glass, and electric wood materials. / 研磨抛光光学玻璃、压电陶瓷、石英玻璃、电木材料。
- Raw materials for stone grinding tools such as diamond clay grinding blocks and precision grinding oilstones. /石材磨具例如菱苦土磨块、精磨油石的原材料。
- Fillers for diamond water grinding discs and resin diamond grinding wheels. / 金刚石水磨片、树脂金刚石砂轮的填料。
- Grinding non-ferrous metal alloys and hard alloys. / 研磨有色金属合金、硬质合金。
- Precision polishing, lapping in silicon wafer industry. / 半导体行业硅片研磨。
- Additives to wear resistant, anti-corrosion, and high-temperature resistant coatings such as fluorocarbon coatings and PTFE non-stick coatings. / 耐磨防腐耐高温涂料例如氟碳涂料、特氟龙不沾涂料的耐磨填料。
- Raw material for RBSIC ceramics. / 反应烧结碳化硅陶瓷原料。
- SiC foam ceramics, honeycomb ceramics. / 碳化硅泡沫陶瓷、蜂窝陶瓷。
- Package/包装:
25公斤编织袋+1吨托盘/ 25kgs/Bag+1Ton/Pallet
接受纸袋等定制包装/Customized Packages such as paper bag are available

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