整机尺寸

Overall Dimension

About L 6500*W 1280*H 1950 mm

重量

Weight

About 2800kg

电源

Power Supply

AC 220V 50/60Hz

功率

Power

18KW

气源

Air Pressure

6KG/CM²

控制

Control

PC

材料的宽度

Width of Material

50~400 mm

固晶精度

Bonding Accuracy

±0.02~0.03mm

Applicable Material

适用材质

 PET, PVC, 纸(paper) 等

晶圆盘的规格

Specification of Wafer Ring

8"/12"

芯片的规格

Chip Size

0.2X0.2~2.0X2.0 mm

卷料外径

Outer Diameter of Core

Max. 600mm

卷料内径

Inner Diameter of Core

76mm

产能

UPH

About 15K pcs/Hr

合格率

Pass Rate

About 99.99%